Methods, systems, apparatus and articles of manufacture to monitor a product package

ABSTRACT

Methods, apparatus, systems and articles of manufacture for a blister package are disclosed. An example blister package includes a cavity and a lid having both an open position to provide access to the cavity and a closed position to restrict access to the cavity. The blister package also includes a sensing circuit disposed at a first location on the blister package. The sensing circuit detects when the lid on the cavity is in the open position, exhibits a first output state when the lid on the cavity is in the open position. The blister package also includes a processor disposed at a second location on the blister package. The processor is in communication with the sensing circuit and generates a signal indicating the cavity has been accessed when the sensing circuit exhibits the first output state.

FIELD OF THE DISCLOSURE

This disclosure relates generally to product packaging, and, more particularly, to monitoring a product package.

BACKGROUND

Many product packages include units of a product contained in separate compartments. When a unit of the product is to be removed, a compartment containing a unit of the product is opened and the product is removed. Compartments containing a unit of product are typically sealed and the unit of product is accessed by breaking the seal. Example product packages include blister packages/packs having individual blisters that serve as the product compartments. Each individual compartment includes an individual tablet, pill, capsule, etc.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A and FIG. 1B are exploded, perspective views of an example smart product package having a smart product package monitor to determine when a unit of product has been removed therefrom.

FIG. 2 is a block diagram of an example smart product package monitoring system including the example smart product package of FIG. 1A and FIG. 1B and an example wireless device.

FIG. 3 is a block diagram of the example wireless device of FIG. 2.

FIG. 4 is a flow chart representative of example machine readable instructions which may be executed to implement the example smart product package of FIG. 1A, FIG. 1B and FIG. 2.

FIG. 5 is a flow chart representative of example machine readable instructions which may be executed to implement the example smart product package of FIG. 1A, FIG. 1B and FIG. 2.

FIG. 6 is a flow chart representative of example machine readable instructions which may be executed to implement the example wireless device of FIG. 2 and FIG. 3.

FIG. 7 is a flow chart representative of example machine readable instructions which may be executed to implement the example wireless device of FIG. 2 and FIG. 3.

FIG. 8 is a flow chart representative of example machine readable instructions which may be executed to implement the example wireless device of FIG. 2 and FIG. 3.

FIG. 9 is a flow chart representative of example machine readable instructions which may be executed to implement the example wireless device of FIG. 2 and FIG. 3.

FIG. 10 is a flowchart of an example method to manufacture the example smart blister package of FIG. 1A, FIG. 1B and FIG. 2.

FIG. 11A is a block diagram of an example processor platform capable of executing the instructions of FIGS. 4 and 5 to implement the example smart blister package monitor of FIG. 1B and FIG. 2.

FIG. 11B is a block diagram of an example processor platform capable of executing the instructions of FIGS. 6, 7, 8, and 9 to implement the example wireless device of FIG. 2 and FIG. 3.

The figures are not to scale. Wherever possible, the same reference numbers will be used throughout the drawing(s) and accompanying written description to refer to the same or like parts.

DETAILED DESCRIPTION

Pharmaceuticals, over-the-counter medications, vitamins, and a number of other products are often supplied in a blister package/pack containing individual compartments housing individual units of the product (e.g., tablets, pills, capsules, etc.) The blister packages typically include a base portion that is molded to form a set of blister-like projections on a planar sheet of plastic. After products are placed in the blister-like projections (or cavities), lidding foil (or other type of material) is attached to a side of the base portion such that the lidding foil forms a lid on a set of cavities defined by the blisters. The lidding foil is typically thin enough to be easily punctured and thereby enable access to a unit of product contained in each of the cavities.

Blister packages provide a number of advantages over other forms of product packaging. For example, blister packages provide an airtight seal around each unit of product thereby preventing product degradation due to environmental changes such as humidity variations. Such humidity control is less easily obtained using a pill bottle. In addition, many consumers find blister packages to be more easily portable than a bottle of pills, tablets, etc. Further, some blister packages are more child proof than bottles. Blister packages can also be more environmentally friendly than other forms of packaging as they are typically manufactured using fewer resources (e.g., less plastic). The consumption of a medication contained in a blister package can also be more easily tracked by counting the number of empty (or full) blisters versus having to count the remaining pills in a bottle.

While blister packages provide many advantages, there is a desire for improved methods to track medication/product consumption. In particular, due to advancements in research, the healthcare and pharmaceutical industries are developing new prescription and non-prescription drugs, vitamins, supplements and health aids at an ever-increasing pace. In addition, various other facts, including a movement toward healthier lifestyles, greater access to medical care, and increasing interest in natural remedies has led to the consumption of a greater number of health-related products (e.g., prescription/non-prescription drugs, vitamins, supplements, etc.) Many such products provide maximum benefit when taken according to a product usage schedule. Further, some products when taken together can cause adverse side effects (i.e., contraindications). Additionally, the potency of many such products can be adversely affected by exposure to temperatures or humidity levels that exceed a specified range, and/or may experience degradation when exposed to light for extended periods of time. Thus, there is a need for improved methods to track the consumption of such products.

Methods, system, apparatus, and articles of manufacture disclosed herein provide smart blister packages/packs that perform product usage tracking/monitoring, and environmental condition monitoring. The smart blister package disclosed herein further communicates product usage information to a wireless device. The wireless device records the product usage information and obtains product information from the Internet based on a product identifier and/or product package identifier. The product information can include instructions about how the product is to be consumed, a product usage schedule, a list of contraindicated products, a list of possible side effects, etc. The wireless device generates a variety of prompts, based on the product usage information and product information obtained from the Internet. The prompts can provide the user with product consumption information and assist the user in complying with the product usage schedule. In addition, the wireless device can respond to environmental information collected and supplied by the smart blister package with prompts indicating when the quality of the product may be compromised or degraded due to unsuitable environmental conditions. Numerous other advantages of the smart blister package disclosed herein are described below with reference to the figures.

FIG. 1A is a perspective view of an example smart blister package 100 having a set of example blisters 102A-102H protruding from an example first side 104 of an example thin sheet or film 106. The example thin sheet or film 106 can be made of any material such as, for example, any type of plastic polymer (e.g., polyvinyl chloride, polyvinylidene chloride, polychlorotrifluoroethylene, etc.) The blisters 102A-102H are molded into the plastic sheet 106 using any known process, such as thermoforming, cold forming, etc. An example first side 108 of an example lidding material 110 (shown in exploded view) is attached to an example second side 112 (see FIG. 1B) of the plastic sheet 106.

FIG. 1B is an exploded view of the example smart blister package 100 illustrating the example second side 112 of the plastic sheet 106 and further illustrating an example second side 114 of the example lidding material 110. As illustrated in FIG. 1B, each example blister 102A-102H forms a respective cavity 112A-112H into which a unit of a product can be placed. The product may include any product such as, for example, medication (over-the-counter (OTC), or prescription), vitamins, supplements, pieces of nicotine chewing gum, etc., Further, the product can take any form, provided the product is sized to fit into the blisters, (e.g., tablets, capsules, pills, dissolvable tablets, vitamins, supplements, etc). The blisters 102A-H may be formed into any desired shape and any number of blisters 102A-102H may be molded into the plastic sheet 106. The lidding material 110 is placed onto the plastic sheet 106 to create a lid over the cavities 112A-112H formed by the blisters. Thus, the lidding material 110, also referred to as a lid 110, keeps the product secure within each of the respective cavities 112A-112H formed by each of the respective blisters 102A-102H. In some examples, the lidding material 110 is a thin layer of foil that is easily pierced so as to permit easy access to the product contained in the cavities 112A-112H. In some examples, the lidding material 110 further includes a sheet of paper attached to the sheet of foil to give the lidding material 110 greater integrity, thereby making it more difficult to access the product contained in each of the cavities 112A-112H. In some such examples, the sheet of paper attached to the sheet of foil provides the advantage of making the smart blister package 100 more tamper and/or child proof.

In some examples, an example product dispensing monitor 116 (also referred to herein as a smart blister package monitor and a smart product package monitor) is disposed on the example lid 110. In some examples, all or portions of the product dispensing monitor 116 is/are imprinted onto the lid 110 using a conductive ink. In some examples, all or portions of the product dispensing monitor 116 is/are attached to the lid 110 using any adhesive substance. In some examples, all or portions of the product dispensing monitor 116 is/are attached to or imprinted on another sheet of material (e.g., paper, foil, etc.) that is subsequently attached to (and forms a portion of) the lid 112.

FIG. 2 illustrates a block diagram of the example product dispensing monitor 116 disposed on the lid 110 of the example smart blister package 100 of FIGS. 1A and 1B. In some examples, the product dispensing monitor 116 includes a set of sensing circuits 118A-118H that are coupled via respective example inputs 120A-120H and example outputs 122A-122H to respective example outputs 124A-124H and example inputs 126A-126H of an example first processor 128. In some examples, the first processor 128 is coupled to an example first memory device 129. In some examples, an example power source 130 is coupled to and supplies power to the processor 128 and/or the sensing circuits 118A-118H. In addition, an example wireless transceiver 132 having an example antenna 134 is coupled to the processor 128 to permit communication with one or more example remote wireless devices 136. In some examples, the sensing circuit 118A-118H are disposed at a set of lid locations 138A-138H, respectively, and the respective lid locations 138A-138H are aligned with the respective cavities 112A-112H (see FIG. 1B).

Referring still to FIG. 2, a set of environmental condition monitors/sensors (an example temperature sensor 140, an example humidity sensor 142, an example UV/light sensor 144, etc.) are disposed on the smart blister package 100 to sense/monitor any of set of environmental conditions including (temperature, humidity levels, UV/light exposure, etc.). The environmental conditions monitors/sensors 140, 142, 144 are coupled to provide input to the processor 128.

FIG. 3 is a block diagram of the remote wireless device 136 of FIG. 2 including a second processor 302, a second transceiver 304, a visual display device 306, a speaker 307, a microphone 308, a memory 310 in which a data structure 312 is stored, an input tool 314 (such as a keyboard, trackball mouse, touch-screen, button, etc.), and a power source 316 (e.g., a battery) to power the elements of the wireless device 136. In some examples, the second processor 302 can access the Internet via the second transceiver 304 using any form of wireless communication including, WiFi communication, cellular communications, satellite communications, etc. In some examples, the second processor 302 searches the Internet for product and/or product package information based on a product ID(s) and/or a product package ID(s). In addition, the second processor 302 can download product and/or product package information including information identifying product usage instructions, product usage schedules, product contraindications, product safety instructions, product side effects, etc. In some examples, the remote wireless device 136 is implemented using a mobile telephone capable of cellular, satellite, Bluetooth, Wi-Fi and/or any other form of wireless communication. In some examples, the remote wireless device 136 is implemented as a personal computer or tablet computing device capable of wirelessly communicating with the blister package dispensing monitor 116 in any desired communication format. Together, the smart blister package 100 and the wireless device 136 form a product monitoring system.

In some examples, the remote wireless device 136 is described as being able to wirelessly communicate with the blister package dispensing monitor 116. In some examples, the remote wireless device 136 communicates wirelessly with the blister package dispensing monitor 116 but also includes wired communication capabilities with other devices. In still further examples, the blister package dispensing monitor 116 includes a port (e.g., a USB port, etc.) by which the remote wireless device 136 can be coupled with a wire to the blister package dispensing monitor 116. In yet further examples, the remote wireless device 136 can be replaced with a remote device that communicates with the blister package dispensing monitor 116 via a USB connection.

Referring now to FIG. 2 and to FIG. 3, the respective example sensing circuits 118A-118H are disposed on the example lid 110 at respective lid locations 138A-138H corresponding to the locations at which respective ones of the cavities 102A-102H are disposed on the sheet 106. Thus, each respective sensing circuit 118A-118H is disposed over a respective one of the cavities 102A-102H. In some examples, the respective sensing circuits 118A-118H are configured to monitor the integrity of the lid 110 at the respective lid locations 138A-138H disposed over the respective cavities 112A-112H such that when the portion of the lid 110 at a respective one of the lid locations 138A-138H is intact (e.g., the corresponding one of the cavities 112A-112H is inaccessible), the respective one of the outputs 122A-122H of the respective sensing circuits 118A-118H disposed at the respective one of the lid locations 138A-138H provides a first output signal/indication at a first level. In contrast, when the portion of the lid 110 at a respective one of the lid locations 138A-138H is intact (e.g., the corresponding one of the cavities 112A-112H is accessible), the respective one of the outputs 122A-122H of the respective sensing circuits 118A-118H disposed at the respective one of the lid locations 138A-138H provides the first output signal/indication at a second level. When the first output signal/indication supplied by one (or any) of the sensing circuit outputs 122A-122H is at the first level, a portion of the lid at the respective one of the lid locations 138A-138H is closed and the respective one of the cavities 112A-112H is inaccessible. When the first output signal/indication supplied by one (or any) of the sensing circuit outputs 122A-122H is at the second level, a portion of the lid at the respective one of the lid locations 138A-138H is open and the cavity is accessible.

In some examples, the example sensor circuits 118A-118H are implemented using conductive circuitry configured in a geometric pattern. In some examples, when an electrical current is supplied to one (or any) of the example inputs 120A-120H of the sensor circuits 118A-118H (via a respective one of the example processor outputs 124A-124H) and the portion of the lid at the respective one of the lid locations 138A-138H on which the respective sensor circuit 118A-118H is disposed is intact (is unbroken), a first voltage level appears at a respective one of the example outputs 122A-122H of the respective sensor circuit 118A-118H. In some examples, when an electrical current is supplied to one (or any) of the example inputs 120A-120H of the sensor circuits 118A-118H and the portion of the lid at the respective one of the lid locations 138A-138H on which the respective sensor circuit 118A-118H is disposed is not intact (is broken), a second voltage level appears at a respective one of the example outputs 122A-122H of the respective sensor circuits 118A-118H. In some examples, a change from the first voltage level to the second voltage level occurring at any of the outputs 122A-122H of any of the sensor circuits 118A-118H is referred to as the first output signal/indication and is supplied to the example processor 128. In some examples, the sensor circuits 118A-118H are implemented using circuitry having any desired electrical attribute (e.g., capacitance, inductance, etc.) that changes when a portion of the lid 110 disposed at a respective one of the lid locations 138A-138H is broken.

In some examples, the example first output signal generated by one (or any) of the respective sensing circuits 118A-118H is supplied to a respective one of the set of example processor inputs 126A-126H of the processor 128. The processor 128, which may be implemented using an Intel® Quark™ processor or any other processor, receives the first output signal/indication from each of the sensing circuits 118A-118H and uses the first output signal/indication supplied by each respective sensing circuit 118A-118H to determine the status of the lid at a respective one of the lid locations 138A-138H. In some examples, the power source 130 supplies power to the processor 128 and the sensing circuits 118A-118H and is implemented using a coin cell or a button cell battery. In some examples, the power supply 130 is implemented using a paper battery manufactured using cellulose and nanoscale structures. In some examples, the power supply 130 is implemented using an energy-harvesting battery (e.g., a solar powered battery cell, a mechanical energy harvesting battery cell, etc.).

In some examples, the example processor 128 responds to the set of first output signals/indications supplied by the sensing circuits 118A-118H by generating a second output signal/indication. The processor 128 delivers the second output/indication signal to the example first transceiver 132 for wireless transmission to the remote device(s) 136. In some examples, the temperature sensor 140 senses the temperature of the surroundings of the smart blister package 100 and provides an indication identifying the temperature to the processor 128. The humidity sensor 142 senses the ambient humidity level and provides an indication identifying the humidity level to the processor 128. The light sensor 144 senses the level of light to which the smart blister package 100 is exposed and provides an indication identifying the level of light to the processor 128. In some examples, the processor 128 analyzes the environmental conditions reported by any (or all) of the temperature sensor 140, the humidity sensor 142, and the UV/light sensor 144 and determines whether any of the environmental conditions exceeds or satisfies a corresponding threshold value or falls outside of a corresponding range of threshold values, and, if so, causes a report identifying the offending environmental condition to be transmitted to the remote device(s) 136. In some examples, the processor 128 periodically (or aperiodically) supplies environmental information obtained from any of the environmental sensors 140, 142, and 144 to the first transceiver 132 for delivery to the remote device(s) 136. In some such examples, the remote device 136 is configured to analyze the environmental information to determine whether any of the environmental conditions satisfy or exceed a threshold value or range of values. If the environmental value or range of values are not satisfied, the remote device(s) 136 cause a notification to be generated. The notification informs a user that the example smart blister package 100 is in subject to an environmental condition that may adversely impact the integrity of the product.

In some examples, the example processor 128 receives a probe signal from the example remote wireless device(s) 136. The probe signal can include a request for acknowledgement to which the processor 128 can be programmed/configured to respond with an acknowledgement indicating the processor 128 is operable. In some examples, the first processor 128 can be programmed/configured to respond to the request for acknowledgement from the remote wireless device(s) 136 with a product package identifier/identification code (ID) and/or a product ID. The product package ID and/or the product ID can be stored in the first memory device 129. The product package ID and/or the product ID can be used by the remote wireless device(s) 136 to identify a product contained in the smart blister package 100, the product package ID can be used by the remote wireless device(s) 136 to identify the type of the product/smart blister package 100 associated with the product package ID. In some examples, the request for acknowledgement includes a request to provide the product package ID and/or the product ID. In some examples, the wireless remote device(s) 136 is further configured to transmit a request for information to the processor 128. The request for information can include a request for the product package ID, a request for information identifying the product (e.g., the product ID), a request for information regarding the number of cavities 112A-112H that have been accessed (e.g., have an open/broken lid portion), etc. In some examples, the request for information can include a request for a most recent time at which any of the cavities 112A-112H was accessed. In some examples, the request for information can include a request for a list of times at which any of the cavities 112A-112H were accessed. In some examples, the processor 128 is programmed to respond to the requests with the requested information.

In some examples, the example first processor 128 is programmed/configured to transmit the second output signal/indication identifying that one (or any) of the cavities 112A-112H has been accessed at the time that the access occurs and/or can be programmed to transmit the second output signal/indication in response to a request(s) for such cavity-access information from the example remote wireless device(s) 136. In some examples, the remote wireless device(s) 136 is configured to store information received from the example smart blister package 100 as a record in a data structure. In some examples, the remote wireless device 136 also stores the time at which the second output signal/indication was received in the record. In some examples, the remote wireless device 136 stores the time at which second output signal/indication was received as a time at which a product contained in the example smart blister package 100 was consumed by a user. In some examples, the remote wireless device(s) 136 is configured to use the product package ID and/or the product identifying information received from the smart blister package 100 to download a product usage schedule from the Internet. In some examples, the remote wireless device(s) 136 is configured to use the product usage schedule to generate notifications to a user at times when the product is to be consumed. In some examples, the remote wireless device(s) 136 is configured to record a first time, received from the smart blister package 100, at which a first of the cavities 112A-112H was accessed and to generate a reminder to alert the user at a second time when a next of the products is to be consumed. In some such examples, the remote wireless device 136 is configured to equate the accessing of one of the cavities 112A-112H with a consumption of a product contained within the accessed one of the cavities 112A-112H. In some such examples, the remote wireless device 136 stores, in a data structure, a record indicating that a unit (or units, if more than one of the cavities 112A-112H is accessed at a same time) of the product was consumed at the first time. In some examples, the remote wireless device 136 will prompt the user to verify that a unit (or units) of product was consumed upon receiving one or more of the second output signal/indications indicating that one or more of the cavities 112A-112H was accessed. The prompt can take the form of a message supplied via an audio speaker, or a video display, to which the user may respond by pressing a button on the remote device 136, speaking into a microphone of the remote wireless device 136, shaking the remote wireless device 136, swiping a display on the remote wireless device 136, etc.

In some examples, the example remote wireless device 136 is configured to record a time at which a first (and subsequent ones) of the example cavities 112A-112H was/were accessed (as received from the processor 128) but does not send a reminder to consume another unit of product unless a second output signal/indication fails to be detected by the remote wireless device 136 within a threshold amount of time. In some examples, the threshold amount of time is indicated by the product usage schedule. In some examples, the remote wireless device 136 can respond to a user request to forego sending future prompts regarding the product and/or product consumption.

In some examples, when the product is a medication that a user may need urgently, and without warning, to control, for example, a chronic on-going condition (e.g., diabetes, seizure disorder, asthma, allergies, etc.), the example remote wireless device 136 may be configured to periodically transmit a request for acknowledgement to the processor 128 of the smart blister package 100. In the event the processor 128 does not respond, because, for example, the smart blister package 100 is not within communication range of the remote wireless device 136, the remote wireless device 136 may generate a notification to the user indicating that the smart blister package 100 containing the medication is not within a threshold distance of the user's remote wireless device 136. Assuming, the user keeps the remote wireless device 136 near or on her/his person, the notification will thereby alert the user that the user does not have the medication at hand. The user may then respond by retrieving the smart blister package 100, if desired.

In some examples, the remote wireless device 136 is configured/programmed to respond to one or more of the second output signals/indications identifying that one or more of the cavities 112A-112H has been accessed with a display of one or more questions or reminders for the user. The questions can be regarding any number of topics including, whether the user is experiencing any adverse side effects, whether the user is taking the product with food or liquids (if the product is most effective when taken with food or liquid), whether the user is physically active, whether the user is perceiving any benefit from consuming the product, how the user is feeling physically/mentally, etc. Any responsive information supplied by the user is added to the data structure in which the consumption records are stored.

In some examples, the remote wireless device 136 is configured/programmed to periodically transmit the recorded product consumption/usage information to any of the product manufacturer, the user's physician, a research foundation, a research laboratory, a pharmacy, a personal computer of the user, etc. In some examples, the remote wireless device 136 is configured/programmed to notify the user's pharmacy when a threshold number of the cavities 112A-112H have been accessed, thereby indicating that a product refill may be needed. In some examples, the remote wireless device 136 is configured/programmed to remove any user-identifying information before transmitting the product consumption/usage information to any third party and/or device.

In some examples, the example first transceiver 132 is a first radio frequency identification (RFID) transceiver. In some such examples, the first RFID transceiver 132 receives electromagnetic radiation from the example second transceiver 304 disposed in the remote wireless device 136. In some such examples, the first RFID transceiver 132 converts the received electromagnetic radiation into electrical current to power the example first processor 128. In some such examples, the first power source 130 need not be present or the first power source 130 may be used in a supplemental capacity (e.g., to supplement the power supplied by the RFID signal converter of the first transceiver 132). In some examples, the first transceiver 132 is a first Bluetooth enabled transceiver (and/or Bluetooth Low Energy enabled transceiver) and communicates with the second transceiver 304 (also Bluetooth and/or Bluetooth Low Energy enabled) in the remote wireless device 136. In some examples, the first and second transceivers 132, 304 are implemented using any type of transceiver capable of wireless communication.

Although, in some examples, the smart blister package 100 is described above as transmitting a product ID or product package ID to the wireless device 136, in some examples, the wireless device 136 may prompt the user to enter a product ID or a product package ID displayed on the product package itself The user can be instructed to enter the information via a prompt from the wireless device or in response to an instruction provided on the product package itself The user can also be instructed to download a software app from the Internet for use in collecting and recording cavity access information from the smart blister package 100. In some examples the wireless device 136 prompts the user to scan a Universal Product Code (UPC) label provided on the product package which the wireless device 136 uses to obtain information about the product package and product via the Internet.

While an example manner of implementing the smart blister package 100 is illustrated in FIG. 1A, FIG. 1B, and FIG. 2 and the example manner of implemented the wireless remote device 136 is illustrated in FIG. 2, and FIG. 3, one or more of the elements, processes and/or devices illustrated in FIG. 1A, FIG. 1B, FIG. 2 and FIG. 3 may be combined, divided, re-arranged, omitted, eliminated and/or implemented in any other way. Further, the example sensor circuits 118A-118H, the example first processor 128, the example first memory 129, the example first power supply 130, the example first transceiver 132, the example antenna 134, the example temperature sensor 140, the example humidity sensor 142, the example UV/light sensor 144, the example second processor 302, the example second transceiver 304, the example visual display 306, the example speaker 307, the example microphone 308, the example second memory 310, the example data structure 312, the example input 314, the example second power supply 316 and/or, more generally, the example blister package dispensing monitor 116 of FIG. 1B, and FIG. 2 and/or more generally the remote wireless device 136 of FIG. 2 and FIG. 3 may be implemented by hardware, software, firmware and/or any combination of hardware, software and/or firmware. Thus, for example, any of the example sensor circuits 118A-118H, the example first processor 128, the example first memory 129, the example power supply 130, the example first transceiver 132, the example antenna 134, the example temperature sensor 140, the example humidity sensor 142, the example UV/light sensor 144, the example second processor 302, the example second transceiver 304, the example visual display 306, the example speaker 307, the example microphone 308, the example second memory 310, the example data structure 312, the example input tool 314, the example second power supply 316, and/or, more generally, the example blister package dispensing monitor 116 of FIG. 1B, and FIG. 2, and/or more generally, the remote wireless device 136 of FIG. 2 and FIG. 3 could be implemented by one or more analog or digital circuit(s), logic circuits, programmable processor(s), application specific integrated circuit(s) (ASIC(s)), programmable logic device(s) (PLD(s)) and/or field programmable logic device(s) (FPLD(s)). While an example manner of using the blister package dispensing monitor 116 has been described with respect to the blister package illustrated in FIG. 1A and FIG. 1B, the blister package dispensing monitor 116 may be used to monitor any type of product package having compartments that contain products, wherein the integrity of the compartments is compromised to access the products contained therein. Further, the blister package dispensing monitor 116 may be attached to the blister package in any desired manner. All of portions of the blister package dispensing monitor 116 can be imprinted onto the blister package. All or portions of the blister package dispensing monitor 116 can be attached to the blister package directly or via a sheet of film, foil, paper or any other material.

When reading any of the apparatus or system claims of this patent to cover a purely software and/or firmware implementation, at least one of the example sensor circuits 118A-118H, the example first processor 128, the example first memory 129, the example first power supply 130, the example first transceiver 132, the example antenna 134, the example temperature sensor 140, the example humidity sensor 142, the example UV/light sensor 144, the example second processor 302, the example second transceiver 304, the example visual display 306, the example speaker 307, the example microphone 308, the example second memory 310, the example data structure 312, the example input 314, the example second power supply 316, is/are hereby expressly defined to include a tangible computer readable storage device or storage disk such as a memory, a digital versatile disk (DVD), a compact disk (CD), a Blu-ray disk, etc. storing the software and/or firmware. Further still, the example blister package dispenser monitor 116 of FIG. 1B and FIG. 2 and the example remote wireless device 136 of FIG. 2 and FIG. 3 may include one or more elements, processes and/or devices in addition to, or instead of, those illustrated in FIG. 1B, FIG. 2, and FIG. 3 and/or may include more than one of any or all of the illustrated elements, processes and devices.

Flowcharts representative of example machine readable instructions for implementing the blister package dispensing monitor 116 of FIG. 1B and FIG. 2 and the wireless device 136 of FIG. 2 and FIG. 3 are shown in FIGS. 4, 5, 6, 7, 8 and 9. In these examples, the machine readable instructions comprise a program(s) for execution by a processor such as the processor 1112 shown in the example processor platform 1100 discussed below in connection with FIG. 11. The program(s) may be embodied in software stored on a tangible computer readable storage medium such as a CD-ROM, a floppy disk, a hard drive, a digital versatile disk (DVD), a Blu-ray disk, or a memory associated with the processor 1112, but the entire program and/or parts thereof could alternatively be executed by a device other than the processor 1112 and/or embodied in firmware or dedicated hardware. Further, although the example program is described with reference to the flowcharts illustrated in FIGS. 4-9, many other methods of implementing the example blister package dispensing monitor 116 and the remote wireless device 136 may alternatively be used. For example, the order of execution of the blocks may be changed, and/or some of the blocks described may be changed, eliminated, or combined.

As mentioned above, the example processes of FIGS. 4, 5, 6, 7, 8 and 9 may be implemented using coded instructions (e.g., computer and/or machine readable instructions) stored on a tangible computer readable storage medium such as a hard disk drive, a flash memory, a read-only memory (ROM), a compact disk (CD), a digital versatile disk (DVD), a cache, a random-access memory (RAM) and/or any other storage device or storage disk in which information is stored for any duration (e.g., for extended time periods, permanently, for brief instances, for temporarily buffering, and/or for caching of the information). As used herein, the term tangible computer readable storage medium is expressly defined to include any type of computer readable storage device and/or storage disk and to exclude propagating signals and transmission media. As used herein, “tangible computer readable storage medium” and “tangible machine readable storage medium” are used interchangeably.

Additionally or alternatively, the example processes of FIGS. 4, 5, 6, 7, 8, and 9 may be implemented using coded instructions (e.g., computer and/or machine readable instructions) stored on a non-transitory computer and/or machine readable medium such as a hard disk drive, a flash memory, a read-only memory, a compact disk, a digital versatile disk, a cache, a random-access memory and/or any other storage device or storage disk in which information is stored for any duration (e.g., for extended time periods, permanently, for brief instances, for temporarily buffering, and/or for caching of the information). As used herein, the term non-transitory computer readable medium is expressly defined to include any type of computer readable storage device and/or storage disk and to exclude propagating signals and transmission media. As used herein, when the phrase “at least” is used as the transition term in a preamble of a claim, it is open-ended in the same manner as the term “comprising” is open ended.

The program 400 of FIG. 4 begins at block 402 at which the example first processor 128 (see FIG. 2) senses a first voltage (or other electrical attribute) level at one of the outputs 122A-122H (see FIG. 2) of one of the sensing circuits 118A-118H (see FIG. 2) (block 402). At a later time, the first processor 128 senses a second voltage (or other electrical attribute) level at the same one of the outputs 122A-122H of the same one of the sensing circuits 118A-118H (block 404). The first processor 128 treats the change in voltage level as a first indication that a blister/cavity corresponding to the sensing circuit associated with the change in output voltage has been accessed and responds to the change in output voltage by generating a second indication that the cavity has been accessed (block 406). The first processor 128 delivers the second indication to the first transceiver 132 (see FIG. 2), and causes the first transceiver 132 to transmit the second indication to the remote wireless device 136 (see FIG. 2 and FIG. 3) (block 408). Thereafter, the program 400 ends. The program 400 represents the instructions executed to monitor the output voltage of one of the sensing circuits 118A-118H. The program 400 is repeatedly performed by the first processor 128 with respect to the output status of each of the sensing circuits 118A-118H until the output voltage at each of the sensing circuits 118 has changed, thereby indicating that all of the cavities/blisters have been accessed. In some examples, instead of (or in addition to) transmitting the second indications (also referred to as a cavity-access indication/signal) to the remote wireless device 136 each time a cavity is accessed, the first processor 128 causes a set of records representing the cavity-access indications/signals to be stored in the memory 129 (see FIG. 2) and the first processor 128 causes all or a portion of the set of records to be transmitted to the remote wireless device 136 at a later time. In some such examples, the first processor 128 causes a timestamp or time indicator to be stored with each cavity-access record in the memory 129. The timestamp/time indicator identifies the time that the cavity-access indication/signal was detected. In some examples, when causing a cavity-access indication/signal to be transmitted to the remote wireless device 136, the processor 128 includes a timestamp/time indicator in (or with) the cavity-access indication/signal. In some examples, when causing a cavity access indication/signal to be transmitted to the remote wireless device 136, the processor 128 includes a product ID and/or product package ID in (or with) the cavity-access indication/signal.

The program 500 of FIG. 5 begins at a block 502 at which the example first processor 128 (see FIG. 2), responsive to an initial probe signal received from the wireless device 136 (see FIG. 2 and FIG. 3), transmits a product ID and/or a product package ID. In some examples, the product ID and/or the product package ID is stored in the first memory device 129 coupled to the first processor 128. In some examples, the first processor 128 begins monitoring the output status of the sensing circuits 118A-118H, responsive to the initial probe signal (block 504). In some examples, in response to a change in the output status of any of the sensing circuits 118A-118H, the first processor 128 causes an indication of such output status change to be transmitted to the wireless device 136 via the first transceiver 132 (also block 504). In some examples, the first processor 128 causes a time at which the output status changed to be included in the transmission to the wireless device 136. In some examples, the first processor 128 transmits output status information (including changes thereto) to the wireless device 136 in response to a request for status information from the wireless device 136. The first processor 128 additionally responds to environmental information supplied by one or more environmental monitors (e.g., the temperature sensor 140 (see FIG. 2), the humidity sensor 142 (see FIG. 2), the UV/light sensor 144 (see FIG. 2)) (block 506). In some examples, the first processor 128 transmits information supplied by the environmental monitors to the wireless device 136 for analysis. In some examples, the first processor 128 analyzes the information supplied by the environmental monitors/sensors to determine whether one or more threshold conditions are satisfied and/or exceeded. If such threshold conditions are satisfied and/or exceeded, the first processor 128 transmits an alert signal/notification to the wireless device 136 indicating that an environmental condition has satisfied and/or exceeded a threshold level. The second processor 302 of the wireless device 136 can respond to the notification by generating a user-prompt alerting the user to the potentially adverse environmental conditions. Thereafter, the program 500 returns to the block 504 and the block subsequent thereto until the output status of all of the sensing circuits 118A-118H have changed such that all of the corresponding cavities have been accessed.

FIG. 4 and FIG. 5 provide example operations performed by the example blister package dispensing monitor 116 of the smart blister package 100 (see FIGS. 1A, 1B, and 2) whereas the program 600 of FIG. 6 provides example operations performed by the example remote wireless device 136 (see FIG. 2 and FIG. 3). The program 600 of FIG. 6 begins at block 602 at which the wireless device receives a first output signal/indication from the smart blister package 100 indicating that a cavity/blister 112A-112H, 102A-102H of the smart blister package 100 has been accessed. In response to the first output signal/indication, the second processor 302 of the wireless device 136 stores a record indicating that a cavity/blister of the smart blister package 100 has been accessed (block 604). In some examples, the wireless device 136 includes a time in the record. The recorded time can correspond to a time at which the first output signal/indication was received, or can correspond to a time identifier included in the first output signal/indication. In some examples, the wireless device 136 generates a first user-input prompt for display at the display tool 306, and/or for emission by the speaker 307, regarding the cavity access (block 606). In some examples, the first user prompt can include a verification request which prompts the user to verify that the cavity-access occurred. In some examples, the first user prompt also, or instead, prompts the user to verify that a unit of product has been consumed. In some examples, the first user prompt can include any of a set of questions for the user regarding the product, the health of the user, the manner in which the unit of product was consumed, etc. In some examples, the first user prompt can include instructions regarding how the unit of product is to be consumed and/or warnings regarding improper product usage, contraindications, etc. Further, the first user prompt can include questions regarding other medications, supplements, products, etc., currently being taken by the user. In some examples, the second processor 302 can generate a second user prompt indicating a time at which another unit of product is to be consumed based on a time at which the first output signal/indication was received from the smart blister package 100 (block 608). In some examples, the second processor 302 can determine the time at which the next unit of product is to be consumed by consulting a product usage schedule. In some examples, the second processor 302 obtains the product usage schedule from a website based on the product ID and/or the product package ID of the smart blister package 100. The second processor 302 determines whether all of the units of product contained in the smart blister package 100 have been consumed (block 610). In some examples, the second processor 302 can make the determination based on a number of output signals/indications of cavity-access that have been received from the smart blister package 100 and compare the number of cavity-access indications to a number of cavities 112A-112H contained in the smart blister package 100. The second processor 302 can query the smart blister package 100 for the number of cavities 112A-112H included in the smart blister package 100 and/or the second processor 302 can determine the number of number of cavities 112A-112H included in the smart blister package 100 based on the product ID and/or the product package ID. In some examples, all or some of the cavity-access indications/signals include the package ID and/or the product package ID. If all of the cavities 112A-112H have not been accessed, the program returns to the block 602 and the blocks subsequent thereto. If all of the cavities 112A-112H have been accessed, the program 600 ends.

The program 700 of FIG. 7 provides example operations performed by the example wireless device 136 of FIG. 2 and FIG. 3 and begins at a block 702 at which the wireless device 136 receives a product package ID and/or a product ID from a smart blister package 100. The second processor 302 of the wireless device 136 uses the product package ID and/or the product ID to access information about the product and/or the product package via the Internet (block 704). In some examples, the second processor 302 determines whether information about the product package and/or the product is stored in the second memory 310 prior to accessing the information via the Internet. In some such examples, the second processor 302 may forego accessing the information via the Internet based on how recent the stored information was placed in the second memory 310. In some examples, the second processor 302 generates user prompts based on product information and/or product package information (block 706). The user prompts can include instructions regarding the consumption of the product, questions regarding the user, questions regarding other products currently being consumed by the user, etc. In some examples, the user prompts may indicate that the product is contraindicated with another product the user is currently consuming. In some such examples, the product information identifies a list of contraindicated products and the second processor 302 compares the list of contraindicated products with a list of products currently being consumed by the user. The list of products currently being consumed by the user can be stored in the second memory 310. In some examples, the list of products currently being consumed by the user is entered into the wireless device 136 by the user. In some examples, the list of products currently being consumed by the user is collected from other smart blister packages associated with the user. In some examples, the list of product currently being consumed by the user is downloaded by the wireless device 136 from a pharmacy into the second memory 310. In some examples, the second processor 302 uses a product usage schedule included in the product information to generate user prompts that include reminders as to when the product is to be consumed (block 708). In some examples, the second processor 302 only generates such reminders about product consumption when a cavity-access indication is not received within a threshold amount of time based on the product usage schedule (e.g., the product is to be consumed every twelve hours and thirteen hours have elapsed since a most recent cavity-access indication was received). In some examples, the second processor 302 continues to generate user prompts that include reminders until all of the units of product in the smart blister package 100 have been consumed (e.g., all of the cavities/blisters have been accessed) and the program ends.

The program 800 of FIG. 8 provides example operations performed by the example wireless device 136 of FIG. 2 and FIG. 3 and begins at a block 802 at which the second processor 302 generates a product consumption report. The second processor 302 generates the product consumption report based on the cavity-access information stored in the data structure 312 of the second memory 310. In some examples, the report further includes information entered by the user in response to any of the set of user prompts (described above) generated by the second processor 302. The second processor 302 causes the consumption report to be transmitted to a third party (block 804), provided that the user has agreed to share the consumption report with the third party. In some examples, the third party is a physician, a research laboratory, a research entity, a pharmaceutical company, a product manufacturer, etc. After transmission of the consumption report, the program ends.

The program 900 of FIG. 9 provides example operations performed by the example wireless device 136 of FIG. 2 and FIG. 3 and begins at a block 902 at which the second processor 302 generates and transmits a request for acknowledgement to the smart blister package 100 (block 902). The second processor 302 determines whether an acknowledgement is received within a first threshold amount of time (block 904). If the acknowledgement is received, the smart blister package is within communication range of the wireless device 136 and the second processor 302 waits a second threshold amount of time (block 906) before again sending a request for acknowledgement (block 902). If an acknowledgement is not received from the smart blister package within the first threshold amount of time, the second processor 302 generates a user prompt for display at the visual display device/tool 306 or for emission by the speaker 307 (block 908). In some examples, the user prompt indicates that the smart blister package is not within communication range of the wireless device 136. The user may respond by ignoring the user prompt, by retrieving the smart blister package 100 (assuming the user has the wireless device on her/his person). In some examples, the user can respond with a request for information identifying the location of the wireless device 136 when a last-received acknowledgement was obtained from the smart blister package 100. In response, the second processor 302 displays via the display tool 306 or announces via the speaker 307 the requested information identifying the location. In some such examples, each time the wireless device 136 receives an acknowledgement signal from the smart blister package 100, the second processor 302 records a location at which the wireless device 136 is located and/or a time at which the acknowledgement was received. In some examples, the second processor 302 continues to send acknowledgement requests until all of the cavities 112A-112H have been accessed as determined by the second processor 302 in the manner described above. In some examples, the second processor 302 continues to send acknowledgement requests until all of the cavities 112A-112H have been accessed as determined by the second processor 302, or until the user instructs the second processor 302 to discontinue sending the acknowledgement requests and the program ends.

FIG. 10 illustrates a method of manufacturing the smart blister package of FIG. 1A, FIG. 1B and FIG. 2. The method begins at a block 1002 at which a sensing circuit (such as any of the sensing circuits 118A-118H) is placed on a blister package at a location (such as any of the locations 138A corresponding to a blister/cavity (such as any of the blisters/cavities 102A-102H, 112A-112H). In addition, a processor (such as the first processor 128) is placed on the blister package (bock 1004) and coupled to the sensing circuit. A transceiver (such as the first transceiver 132) is placed on the blister package (block 1006) and coupled to the processor. In some examples, environmental sensors (such as any of the temperature sensor 140, the humidity sensor 142, the UV/light sensor 144, etc) are placed on the blister package and coupled to the processor (block 1008). A memory (such as the first memory 129) having a product ID and/or a product package ID (and/or a number of cavities/blisters contained in the blister package, an expiration date of a product housed in the blisters of the blister package, etc.) stored therein is placed on the blister package (block 1010). Thereafter, the method ends.

FIG. 11A is a block diagram of an example processor platform 1100A capable of executing the instructions of FIGS. 4 and 5 to implement the smart blister package monitor 116 of FIG. 1B and FIG. 2. The processor platform 1100 can be, for example, a microcontroller unit such as an Intel® Quark™ or any other type of computing device having a similar form factor.

The processor platform 1100A of the illustrated example includes a processor 1112A. The processor 1112A of the illustrated example is hardware. For example, the processor 1112A can be implemented by one or more integrated circuits, logic circuits, microprocessors or controllers from any desired family or manufacturer. In some examples in which the processor platform 1100A implements smart blister package monitor 116, the processor 1112A includes the example first processor 128 (see FIG. 2).

The processor 1112A of the illustrated example includes a local memory 1113A (e.g., a cache). The processor 1112A of the illustrated example is in communication with a main memory including a volatile memory 1114A and a non-volatile memory 1116A via a bus 1118A. The volatile memory 1114A may be implemented by Synchronous Dynamic Random Access Memory (SDRAM), Dynamic Random Access Memory (DRAM), RAMBUS Dynamic Random Access Memory (RDRAM) and/or any other type of random access memory device. The non-volatile memory 1116A may be implemented by flash memory and/or any other desired type of memory device. Access to the main memory 1114A, 1116A is controlled by a memory controller. In some examples, the volatile memory 1114A includes the example first memory 129 (see FIG. 2).

The processor platform 1100A of the illustrated example can also include an interface circuit 1120A. The interface circuit 1120A may be implemented by any type of interface standard, such as an Ethernet interface, a universal serial bus (USB), and/or a PCI express interface.

In the illustrated example, one or more input devices 1122A are connected to the interface circuit 1120A. The example temperature sensor 140A, the example humidity sensor 142A and the example UV/light sensor 144A can be implemented using the input device(s) 1122A.

One or more output devices 1124A can also be connected to the interface circuit 1120A of the illustrated example. The output devices 1124 can be implemented, for example, by display devices (e.g., a light emitting diode (LED), an organic light emitting diode (OLED), a liquid crystal display, emitting diode (LED). The interface circuit 1120A of the illustrated example, thus, typically includes a graphics driver card, a graphics driver chip or a graphics driver processor.

The interface circuit 1120A of the illustrated example also includes a communication device such as a transmitter, a receiver, a transceiver, a modem and/or network interface card to facilitate exchange of data with external machines (e.g., computing devices of any kind) via a network 1126A (e.g., an Ethernet connection, a digital subscriber line (DSL), a telephone line, coaxial cable, a cellular telephone system, a low power wireless area network, etc.). In some examples, the example first transceiver 132 is implemented using the interface circuit 1120A.

The coded instructions 1132A of FIGS. 4 and 5 may be stored in the volatile memory 1114A, or in the non-volatile memory 1116A

FIG. 11B is a block diagram of an example processor platform 1100B capable of executing the instructions of FIGS. 6, 7, 8, and 9 to implement the example wireless device 136 of FIG. 2 and FIG. 3. The processor platform 1100B can be, for example, a server, a personal computer, a mobile device (e.g., a cell phone, a smart phone, a tablet such as an iPad™), a personal digital assistant (PDA), an Internet appliance, a microcontroller unit or any other type of computing device.

The processor platform 1100B of the illustrated example includes a processor 1112B. The processor 1112 B of the illustrated example is hardware. For example, the processor 1112B can be implemented by one or more integrated circuits, logic circuits, microprocessors or controllers from any desired family or manufacturer. In some examples in which the processor platform 1100B implements the wireless device 136, the processor 1112B includes the example second processor 302.

The processor 1112B of the illustrated example includes a local memory 1113B (e.g., a cache). The processor 1112B of the illustrated example is in communication with a main memory including a volatile memory 1114B and a non-volatile memory 1116B via a bus 1118B. The volatile memory 1114B may be implemented by Synchronous Dynamic Random Access Memory (SDRAM), Dynamic Random Access Memory (DRAM), RAMBUS Dynamic Random Access Memory (RDRAM) and/or any other type of random access memory device. The non-volatile memory 1116B may be implemented by flash memory and/or any other desired type of memory device. Access to the main memory 1114B, 1116B is controlled by a memory controller. In some examples, the example second memory is implemented using the volatile memory 1114B.

The processor platform 1100B of the illustrated example also includes an interface circuit 1120B. The interface circuit 1120B may be implemented by any type of interface standard, such as an Ethernet interface, a universal serial bus (USB), and/or a PCI express interface.

In the illustrated example, one or more input devices 1122B are connected to the interface circuit 1120B. The input device(s) 1122B can be implemented with the example keyboard/touch pad 1123B and permit(s) a user to enter data and commands into the processor 1112B. In some examples, the input device(s) can be implemented by, for example, an audio sensor, a microphone, an image sensor (still or video), a keyboard, a button, a mouse, a touchscreen, a track-pad, a trackball, isopoint and/or a voice recognition system. In some examples, the example input 314 and the example microphone 308 are implemented using the input device 1122B.

One or more output devices 1124B are also connected to the interface circuit 1120B of the illustrated example. The output devices 1124B can be implemented, for example, by display devices (e.g., a light emitting diode (LED), an organic light emitting diode (OLED), a liquid crystal display, a cathode ray tube display (CRT), a touchscreen, a tactile output device, a light emitting diode (LED), a printer and/or speakers). The interface circuit 1120B of the illustrated example, thus, typically includes a graphics driver card, a graphics driver chip or a graphics driver processor. In some examples, the example display device/tool 306 and/or the example speaker 307 are implemented using the output device 1124B.

The interface circuit 1120B of the illustrated example also includes a communication device such as a transmitter, a receiver, a transceiver, a modem and/or network interface card to facilitate exchange of data with external machines (e.g., computing devices of any kind) via a network 1126B (e.g., an Ethernet connection, a digital subscriber line (DSL), a telephone line, coaxial cable, a cellular telephone system, a low power wireless area network, etc.). In some examples, the example second transceiver 304 is implemented using the interface circuit 1120B.

The processor platform 1100B of the illustrated example also includes one or more mass storage devices 1128B for storing software and/or data. Examples of such mass storage devices 1128B include floppy disk drives, hard drive disks, compact disk drives, Blu-ray disk drives, RAID systems, and digital versatile disk (DVD) drives. In some examples, the example second memory device 310 is implemented using the mass storage devices 1128B.

The coded instructions 1132B of FIGS. 6, 7, 8, and 9 may be stored in the mass storage device 1128B, in the volatile memory 1114B, in the non-volatile memory 1116B, and/or on a removable tangible computer readable storage medium such as a CD or DVD.

From the foregoing, it will appreciated that the above disclosed methods, apparatus, systems and articles of manufacture permit monitoring the removal of products from a blister package or other product container by determining when a cavity containing a unit of product has been accessed. The example methods, systems, apparatus and articles of manufacture disclosed herein are used to identify when a cavity-access on a product contained has occurred (e.g., when a cavity containing a unit of product has been accessed), to report the cavity-access (and a corresponding time of access) to a wireless device, to record the fact of (and time of) the cavity access, the generate user prompts, reminders and instructions regarding cavity accesses and product usage/consumption, to request user information regarding the product and product usage, to monitor compliance with a product usage schedule, to monitor environmental conditions to which the product container is subjected, to identify when the environmental conditions satisfy or exceed threshold environmental conditions, to assist in locating a product container, to obtain a product ID and/or product package ID, to use a product ID and product package ID to obtain product information from the Internet, etc. The example methods, systems, apparatus and articles of manufacture disclosed herein provide a variety of advantages. For example, the methods, system, apparatus and articles of manufacture, tracking cavity-accesses on a blister package containing, for example, medication and correlating the cavity-accesses to medication consumption, can help a medication consumer remain in compliance with a prescribed (or recommended) product usage schedule. In addition, the smart blister packages disclosed herein can help a user to determine when the user is consuming products that are contraindicated with other product also consumed by the user. Further, the smart blister packages can communication a product ID or product package ID to a wireless device which can then use the product ID and/or product package ID to obtain up-to-date information about the product. Moreover, the smart blister packages and wireless devices disclosed herein can be used to determine a most recent location at which the smart blister package transmitted an acknowledgement signal, which can in turn, be used to help the user locate the smart blister package. The smart blister packages disclosed herein are further advantageous in that the product dispensing monitor is installed directly onto the blister package. Further, the product dispensing monitor is thin and lightweight thereby minimizing any impact on the form factor of the blister package. Additionally, the smart blister package can be used to monitor and report the environmental conditions to which the blister package is subjected thereby minimizing any damage that might otherwise be caused by detrimental environmental conditions. Further, the wireless device disclosed can capture and report the product consumption information received from the smart blister package to any of a number of third parties (e.g., the product manufacturer, the user's physician, the user's pharmacy, a research company, etc.) who can use the information to improve the product, the product package, the user's experience, etc.

A plurality of example methods, apparatus, systems, and articles of manufacture are disclosed herein. Example no. 1 is a blister package having a cavity and a lid. The lid includes an open position to provide access to the cavity and a closed position to restrict access to the cavity. The blister package also includes a sensing circuit disposed at a first location on the blister package that detects when the lid on the cavity is in the open position. The sensing circuit exhibits a first output state when the lid on the cavity is in the open position. The blister package further includes a processor disposed at a second location on the blister package. The processor is in communication with the sensing circuit and generates a signal indicating the cavity has been accessed when the sensing circuit exhibits the first output state.

Example no. 2 is the blister package of Example no. 1 and further includes a transceiver disposed at a third location on the blister package. The transceiver is communicatively coupled to the processor and the processor causes the transceiver to transmit the signal.

Example no. 3 is the blister package of Example no. 2, wherein the transceiver includes an antenna and an energy converter. The antenna captures ambient electromagnetic radiation and the energy converter converts the ambient electromagnetic radiation into electrical current to power the processor circuit and the sensing circuit.

Example no. 4 is the blister package of any of Example nos. 2 and 3, wherein the transceiver is at least one of a radio frequency identification transceiver, a Bluetooth enabled transceiver and a Bluetooth Low Energy enabled transceiver.

Example no. 5 is the blister package of Example no. 2, and further includes a power source on the blister package. The power source supplies power to the sensing circuit and to the processor.

Example no. 6 is the blister package of any of Example nos. 1, 2, 3, and 5, wherein the power source is a battery printed on paper attached to the blister package.

Example no. 7 is the blister package of any of Example nos. 1, 2, 3, and 5, wherein the power source is an energy-harvesting battery.

Example no. 8 is the blister package of any of Example nos. 1, 2, 3 and 5 wherein the lid comprises a foil material.

Example no. 9 is the blister package of Example no. 1, wherein the placing of the sensing circuit includes at least one of attaching the sensing circuit to the blister package with an adhesive substance, imprinting the sensing circuit on the blister package, and placing the sensing circuit on another material and attaching the another material to the blister package.

Example no. 10 is the blister package of Example no. 1 wherein the sensing circuit is imprinted on the lid.

Example no. 11 is the blister package of Example no. 1, wherein the sensing circuit has a first level of conductivity when the lid is in the open position and a second level of conductivity when the lid is not in the open position. In Example no. 11, the first level of conductivity causes the sensing circuit to exhibit the first output state and the second level of conductivity causes the sensing circuit to exhibit a second output state.

Example no. 12 is the blister package of Example no. 1, wherein the processor detects when the sensing circuit exhibits the first output state and when the sensing circuit exhibits the second output state.

Example no. 13 is the blister package of Example no. 1, wherein the processor includes a clock mechanism and the processor identifies a time, based on the clock mechanism, at which the sensing circuit begins to exhibit the first output state.

Example no. 14 is the blister package of Example no. 1, wherein the sensing circuit is characterized by a first level of conductance when the lid is open and second level of conductance when the lid is closed. The first level of conductance causes the sensing circuit to exhibit the first output state and the second level of conductance causes the sensing circuit to exhibit a second output state.

Example no. 15 is the blister package of Example no. 1, wherein the sensing circuit is characterized by an electrical attribute that changes from a first level to a second level when the lid moves from a closed position to the open position.

Example no. 16 is the blister package of Example no. 1, wherein the processor includes a clock mechanism and the processor is further to record a time, based on the clock mechanism, at which the sensing circuit begins to exhibit the first output state.

Example no. 17 is the blister package of Example no. 1, further including a memory device. The processor is further to store a record in the memory in response to detecting that the sensing circuit has begun exhibiting the first output state. The record reflects that the sensing circuit has begun exhibiting the first output state.

Example no. 18 is the blister package of Example no. 17, wherein the processor stores, in the memory, a time at which the processor detected that the sensing circuit has begun exhibiting the first output state.

Example no. 19 is the blister package of Example no. 2, wherein the second location and the third location are a same location.

Example no. 20 is an example method to manufacture a product package monitor. The method includes placing a sensing circuit at a first location on a blister package. The blister package has a lid covering a cavity aligned with the first location, the sensing circuit changes from a first state to a second state when the lid covering the cavity is opened. The method also includes placing a processor at a second location on the blister package. The processor is communicatively coupled to the sensing circuit and generates a signal indicating that the lid covering the cavity has been opened in response to detecting that the sensing circuit changed from the first state to the second state.

Example no. 21 is the method of Example no. 20, further including placing a transceiver at a third location on the blister package. The transceiver is communicatively coupled to the processor and transmits the signal.

Example no. 22 is the method of Example no. 21, wherein the transceiver includes an antenna and an energy converter. The antenna captures ambient electromagnetic radiation, and the energy converter converts the ambient electromagnetic radiation into electrical current to power at least one of the processor, the sensing circuit and a battery.

Example no. 23 is the method of any of Example nos. 21 and 22, wherein the transceiver is at least one of a radio frequency identification transceiver, a Bluetooth enabled transceiver, and a Bluetooth Low Energy enabled transceiver.

Example no. 24 is the method of any of Example nos. 20, 21 22 and 23, and further includes placing a power source on the blister package. The power source supplies power to the sensing circuit and the processor.

Example no. 25 is the method of Example no. 24, wherein the power source is a battery printed on a flexible material attached to the blister package.

Example no. 26 is the method of Example no. 24, wherein the power source is an energy-harvesting battery.

Example no. 27 is the method of Example no. 20, wherein the lid includes a foil.

Example no. 28 is the method of Example no. 20, wherein the placing of the sensing circuit includes at least one of attaching the sensing circuit to the blister package with an adhesive substance, imprinting the sensing circuit on the blister package, and placing the sensing circuit onto another material and attaching the another material to the blister package.

Example no. 29 is the method of any of Example nos. 20, 21, 22, 23, and 24, wherein the sensing circuit has a first level of conductivity when the lid is closed and a second level of conductivity when the lid is open. The sensing circuit changes from the first state to the second state by changing from the first level of conductivity to the second level of conductivity.

Example no. 30 is the method of any of Example nos. 20, 22, 23, 24, and 29, wherein the processor detects the change in the sensing circuit from the first level of conductivity to the second level of conductivity at an output of the sensing circuit.

Example no. 31 is the method of any of Example nos. 20, 21, 22, 24, and 29 wherein the processor includes a clock mechanism. In Example no. 31, the processor also identifies a time, based on the clock mechanism, at which the sensing circuit changes from the first state to the second state.

Example no. 32 is the method of Example no. 20, wherein the sensing circuit exhibits an electrical attribute, and the change in the sensing circuit from the first state to the second state includes a change in the electrical attribute of the sensing circuit from a first level to a second level.

Example no. 33 is the method of any of Example nos. 20, 21, 22, 24, and 29, wherein the processor includes a clock mechanism and the processor also records a time, based on the clock mechanism, at which the sensing circuit changes from the first state to the second state.

Example no. 34 is the method of any of Example nos. 20, 21, 22, and 23 and further includes placing a memory device on the blister package. In Example no. 34, the processor stores a record in the memory in response to detecting that the sensing circuit changed from the first state to the second state. The record reflects the change of the sensing circuit from the first state to the second state.

Example no. 35 is the method of any of Example nos. 20, 21, 22, 24, 29, 30, 31, and 34, wherein the processor is further to store, in the memory, a time at which the processor detected the change in the sensing circuit from the first state to the second state.

Example no. 36 is the method of Example no. 21, wherein the second location and the third location are a same location.

Example no. 37 is a method to monitor a product package. The method includes sensing, with a sensing circuit disposed on a lid of a product package, that a portion of the lid covering a cavity containing a unit of product has been broken and also includes generating, with a processor disposed on the product package, a signal indicating that the lid has been broken, in response to the sensing that the lid has been broken by the sensing circuit. The signal includes a time at which the portion of the lid was broken and a product package identifier that identifies the product package.

Example no. 38 is the method of Example no. 37, and further includes storing the time at which the portion of the lid was broken in a memory disposed on the product package.

Example no. 39 is the method of Example no. 37, wherein the signal generated with the processor is delivered to a transceiver disposed on the product package for wireless transmission to a remote device.

Example no. 40 is the method of Example no. 39, wherein the remote device is a mobile telephone.

Example no. 41 is the method of Example no. 39, wherein the wireless transceiver transmits the wireless transmission in response to a probe signal received from the remote device.

Example no. 42 is the method of Example no. 41, wherein the probe signal is a radio frequency identification signal.

Example no. 43 is the method of Example no. 37, wherein an output of the sensing circuit changes from a first state to a second state when the portion of the lid covering the cavity has been broken.

Example no. 44 is the method of Example no. 43, and further includes determining, with the processor, whether the output of the sensing circuit is in the first state or the second state in response to receiving a probe signal from a remote device.

Example no. 45 is the method of Example no. 44, wherein the signal is a first signal. The method of Example no. 45 further includes, generating, with the processor, a second signal indicating that the lid has not been broken in response to determining the output of the sensing circuit is in the first state.

Example no. 46 is the method of Example no. 41, wherein the probe signal represents a request for at least one of the product package device and a product identifier.

Example no. 47 is the method of Example no. 41, wherein the probe signal represents a request for the time at which the portion of the lid was broken.

Example no. 48 is the method of Example no. 37, wherein the product package is a blister package and the cavity is defined by a blister of the blister package.

Example no. 49 is the method of Example no. 48, wherein the product is a medication and the unit is one of a tablet of the medication, or a capsule of the medication.

Example no. 50 is a tangible machine readable storage medium comprising instructions which, when executed, cause a machine to at least determine if an output of a sensing circuit disposed on a lid covering a cavity of a product dispensing device is at a first output level. The first output level indicates the lid has been broken and the cavity contains a unit of product. The instructions also cause the machine to, in response to determining the output of the sensing circuit is at the first output level, generate a signal indicating the lid has been broken.

Example no. 51 is the tangible machine readable storage medium of Example no. 50, wherein the instructions further cause the machine to deliver the signal to a transceiver for transmission to a remote device.

Example no. 52 is the tangible machine readable storage medium of Example no. 50, wherein the remote device is a mobile telephone.

Example no. 53 is the tangible machine readable storage medium of Example no. 50, wherein the instructions further cause the machine to determine a time at which the output of the sensing circuit was determined to be at the first output level, include the time in the signal, and deliver the signal to a transceiver for transmission to a remote device.

Example no. 54 is the tangible machine readable storage medium of Example no. 50, wherein the instructions further cause the machine to deliver at least one of a product dispensing device identifier and a product identifier to a transceiver for transmission to a remote device.

Example no. 55 is the tangible machine readable storage medium of Example no. 53, wherein the instructions further cause the machine to deliver the signal to the transceiver in response to a probe signal received from the remote device.

Example no. 56 is the tangible machine readable storage medium of Example no. 55, wherein the probe signal is at least one of a radio frequency identification signal, a Bluetooth signal, and a Bluetooth Low Energy signal.

Example no. 57 is the tangible machine readable storage medium of Example no. 50, wherein the signal is a first signal and the instructions further to cause the machine to generate a second signal to indicate the lid has not been broken in response to determining the output of the sensing circuit is at a second output level.

Example no. 58 is the tangible machine readable storage medium of Example no. 50, wherein the instructions further cause the machine to respond to a probe signal from the remote device. The probe signal is responsive to the transmission of the signal from the transceiver, and the probe signal includes a request for an identifier of at least one of the product dispensing device and the product.

Example no. 59 is the tangible machine readable storage medium of Example no. 58, wherein the probe signal further includes a request for a time at which the output of the sensing circuit was determined to be at the first output level.

Example no. 60 is the tangible machine readable storage medium of Example no. 50, wherein the product dispensing device is a blister package having a monitor and the cavity is a blister of the blister package.

Example no. 61 is the tangible machine readable storage medium of Example no. 60, wherein the product is a medication and the unit is one of a tablet of the medication, and a capsule of the medication.

Example no. 62 is the tangible machine readable storage medium of Example no. 50, wherein the instructions further cause the machine to identify a time at which the output of the sensing circuit was determined to be at the first output level, generate a record indicating that the lid has been broken and indicating the time at which output of the sensing circuit was determined to be at the first output level, and store the record in a memory disposed on the product dispensing device.

Example no. 63 is a tangible machine readable storage medium comprising instructions which, when executed, cause a machine to at least detect a first indication transmitted from a product dispensing monitor disposed on a product package containing a product. The first indication indicates that a product-containing cavity on the product package has been accessed. The instructions also cause the machine to identify at least one of the product package or the product dispensing monitor that transmitted the first indication and to store a product usage record in a data table, based on the identifying. The product usage record indicates the product-containing cavity was accessed.

Example no. 64 is the tangible machine readable medium of Example no. 63, wherein the instructions further cause the machine to transmit a probe signal to the product package. The probe signal causes the product dispensing monitor to transmit the first indication.

Example no. 65 is the tangible machine readable medium of Example no. 63, wherein the instructions further cause the machine to determine whether the product-containing cavity was accessed in accordance with a product usage schedule and based on whether the product-containing cavity was accessed in conformance with a prescribed product usage schedule, generate a product usage conformance notification.

Example no. 66 is the tangible machine readable medium of Example no. 65, wherein the instructions cause the machine to determine whether the product-containing cavity was accessed in conformance with a product usage schedule by identifying a time at which the product-containing cavity was accessed, and determine whether the time is within a range of time specified by the product usage schedule.

Example no. 67 is the tangible machine readable medium of Example no. 63, wherein the instructions further cause the machine to respond to a second indication signal transmitted from the product dispensing monitor disposed on the product package by generating a temperature alert indicating that the product package is not within a desired temperature range.

Example no. 68 is the tangible machine readable medium of Example no. 67, wherein the instructions further cause the machine to display the temperature alert.

Example no. 69 is the tangible machine readable storage medium of Example no. 63, wherein the product package is a first product package and the instructions further to cause the machine to compare the first product package to a list identifying a plurality of product packages and to determine, based on the comparing of the first product package to the list identifying a plurality of product packages, whether the product contained in the product package is contraindicated with any product contained in the plurality of product packages. The instructions also cause the machine to generate a contraindication notification, if a product contained in the product package is determined to be contraindicated.

Example no. 70 is the tangible machine readable medium of Example no. 63, wherein the product is a first unit of product, and the instructions further to cause the machine to record a time at which the first indication was detected, and, if a second indication indicating that a second product-containing cavity of the product package was accessed is not received within a threshold amount of time, generate an alert. The alert indicates nonconformance with a product usage schedule.

Example no. 71 is a product monitoring system including a product access monitor disposed on a product package. The product access monitor determines when a cavity containing a product in the product package has been accessed. The product access monitor also transmits an indication when the cavity has been accessed. The product monitoring system also includes a device in communication with the product access monitor. The device stores a record indicating that the cavity has been accessed in response to the indication.

Example no. 72 is the product monitoring system of Example no. 71, wherein the product package is a blister package and the cavity is defined by a blister.

Example no. 73 is the product monitoring system of Example no. 72, wherein the product access monitor a sensing circuit disposed on a lid of the cavity. The sensing circuit has an output that changes from a first output state to second output state when the cavity has been accessed. The product access monitor also includes a processor that responds to the change in the output of the sensing circuit by causing the indication to be generated.

Example no. 74 is the product monitoring system of Example no. 73, wherein the output of the sensing circuit changes from the first output state to the second output state when the lid is opened.

Example no. 75 is the product monitoring system of Example no. 71, wherein the device responds to the indication by generating a user-prompt for display, the user prompt to request verification that the access of the cavity corresponds to consumption of a product extracted from the cavity.

Example no. 76 is the product monitoring system of Example no. 71, wherein the product access monitor includes environmental sensors to sense environmental conditions to which the product package is exposed.

Example no. 77 is the product monitoring system of Example no. 76, wherein the product access monitor transmits environmental information collected by the environmental sensors to the device.

Example no. 78 is the product monitoring system of Example no. 77, wherein the device also analyzes the environmental information to determine whether the product package is subjected to adverse environmental conditions. Additionally, the device generates a prompt for display based on whether the product package is determined to be subjected to adverse environmental conditions.

Example no. 79 is the product monitoring system of Example no. 71, wherein the device is a wireless device.

Example no. 80 is the product monitoring system of Example no. 79, wherein the wireless device is a mobile telephone.

Example no. 81 is an apparatus having means to perform any of the methods of the Examples described above.

Example no. 82 is a tangible machine readable storage medium storing instructions that, when executed, cause a machine to implement a method or realize an apparatus as disclosed in any of the Examples provided above.

Although certain example methods, apparatus and articles of manufacture have been disclosed herein, the scope of coverage of this patent is not limited thereto. On the contrary, this patent covers all methods, apparatus and articles of manufacture fairly falling within the scope of the claims of this patent. 

1. A blister package comprising: a cavity; a lid having an open position to provide access to the cavity and a closed position to restrict access to the cavity; a sensing circuit disposed at a first location on the blister package, the sensing circuit to detect when the lid on the cavity is in the open position, and the sensing circuit to exhibit a first output state when the lid on the cavity is in the open position; and a processor disposed at a second location on the blister package, the processor being in communication with the sensing circuit, and the processor to generate a signal indicating the cavity has been accessed when the sensing circuit exhibits the first output state.
 2. The blister package as defined in claim 1, further including a transceiver disposed at a third location on the blister package, the transceiver being communicatively coupled to the processor, and the transceiver to transmit the signal.
 3. The blister package as defined in claim 2, wherein the transceiver includes an antenna and an energy converter, the antenna to capture ambient electromagnetic radiation, the energy converter to convert the ambient electromagnetic radiation into electrical current, and the electrical current to power the processor circuit and the sensing circuit.
 4. The blister package as defined in claim 2, wherein the transceiver is at least one of a radio frequency identification transceiver, a Bluetooth enabled transceiver and a Bluetooth Low Energy enabled transceiver.
 5. The blister package as defined in claim 2, further including a power source on the blister package, the power source to supply power to the sensing circuit and the processor.
 6. The blister package as defined in claim 1, wherein the sensing circuit is characterized by an electrical attribute that changes from a first level to a second level when the lid changes from a closed position to the open position.
 7. The blister package as defined in claim 1, wherein the processor includes a clock mechanism and the processor is further to record a time, based on the clock mechanism, at which the sensing circuit begins to exhibit the first output state.
 8. The blister package as defined in claim 1, further including a memory device, wherein the processor is further to store a record in the memory device in response to detecting that the sensing circuit has begun exhibiting the first output state, the record reflecting that the sensing circuit has begun exhibiting the first output state.
 9. A method to manufacture a product package monitor comprising: placing a sensing circuit at a first location on a blister package, the blister package having a lid covering a cavity aligned with the first location, the sensing circuit to change from a first state to a second state when the lid covering the cavity is opened; and placing a processor at a second location on the blister package, the processor being communicatively coupled to the sensing circuit, the processor to generate a signal indicating that the lid covering the cavity has been opened in response to detecting that the sensing circuit changed from the first state to the second state.
 10. The method as defined in claim 9, further including placing a transceiver at a third location on the blister package, the transceiver being communicatively coupled to the processor, and the transceiver to transmit the signal.
 11. The method as defined in claim 10, wherein the transceiver includes an antenna and an energy converter, the antenna capturing ambient electromagnetic radiation, the energy converter converting the ambient electromagnetic radiation into electrical current to power at least one of the processor, the sensing circuit and a battery.
 12. The method as defined in claim 10, wherein the transceiver is at least one of a radio frequency identification transceiver, a Bluetooth enabled transceiver, and a Bluetooth Low Energy enabled transceiver.
 13. The method as defined in claim 9, further including placing a power source on the blister package, the power source to supply power to the sensing circuit and the processor.
 14. The method as defined in claim 9, wherein the sensing circuit has a first level of conductivity when the lid is closed and a second level of conductivity when the lid is open, and the sensing circuit changes from the first state to the second state by changing from the first level of conductivity to the second level of conductivity.
 15. The method as defined in claim 14, wherein the processor detects the change in the sensing circuit from the first level of conductivity to the second level of conductivity at an output of the sensing circuit.
 16. The method as defined in claim 9, wherein the processor includes a clock mechanism and the processor is further to identify a time, based on the clock mechanism, at which the sensing circuit changes from the first state to the second state, and (ii) include the time in the signal.
 17. The method as defined in claim 9, wherein the processor includes a clock mechanism and the processor is further to record a time, based on the clock mechanism, at which the sensing circuit changes from the first state to the second state.
 18. The method as defined in claim 9, further including placing a memory device on the blister package, wherein the processor is further to store a record in the memory device in response to detecting that the sensing circuit changed from the first state to the second state, the record reflecting the change of the sensing circuit from the first state to the second state.
 19. A method to monitor a product package, the method comprising: sensing, with a sensing circuit disposed on a lid of a product package, that a portion of the lid covering a cavity containing a unit of product has been broken; and in response to the sensing that the lid has been broken by the sensing circuit, generating, with a processor disposed on the product package, a signal indicating that the lid has been broken, the signal to include a time at which the portion of the lid was broken and a product package identifier that identifies the product package.
 20. The method as defined in claim 19, further including storing the time at which the portion of the lid was broken in a memory disposed on the product package.
 21. The method as defined in claim 19, wherein the signal generated with the processor is delivered to a transceiver disposed on the product package for wireless transmission to a remote device.
 22. The method as defined in claim 19, wherein an output of the sensing circuit changes from a first state to a second state when the portion of the lid covering the cavity has been broken.
 23. A tangible machine readable storage medium comprising instructions which, when executed, cause a machine to at least: determine if an output of a sensing circuit disposed on a lid covering a cavity of a product dispensing device is at a first output level, the first output level indicating the lid has been broken, the cavity containing a unit of product; and in response to determining the output of the sensing circuit is at the first output level, generate a signal indicating the lid has been broken.
 24. The tangible machine readable storage medium as defined in claim 23, wherein the instructions further cause the machine to deliver the signal to a transceiver for transmission to a remote device.
 25. The tangible machine readable storage medium as defined in claim 23, wherein the instructions further cause the machine to: determine a time at which the output of the sensing circuit was determined to be at the first output level; include the time in the signal; and deliver the signal to a transceiver for transmission to a remote device. 